| 摘要 |
A heat sink suitable for IC chips, having high mechanical strength, is produced by infiltrating metal into pores in a carbon material, giving increased wettability between the heat sink material and plated solder layer covering the surface. The metal can have a low solidification temperature, low level of segregation, high wettability or expansion/inhibited shrinkage on solidification. In one embodiment, a mass of graphite is placed into case 70, which is put into a furnace (fig 6: 60) (fig 8: S301). The space in the furnace is heated, producing a porous sintered graphite body 12 (fig 8: S302). The case containing the porous body is removed from the furnace and put into cavity 80 in press 62 (fig 8: S303). A molten mass 86 of a metal is poured into the case (fig 8: S304), and a punch 84 is inserted into the cavity to press the molten metal 86 into the porous sintered body 12 (fig 8: S305). |
