发明名称 |
Heat-resistant film base-material-inserted B-staged resin composition sheet excellent in adhesion to resin, multilayer board using the sheet and manufacturing process of the multilayer board |
摘要 |
A heat-resistant film base-material-inserted B-staged resin composition sheet obtainable by adhering a layer of a B-staged resin composition to a heat-resistant film base material, wherein the heat-resistant film base material is plasma-treated before adhering the B-staged resin composition layer, a multilayer board using the above heat-resistant film base-material-inserted B-staged resin composition sheet in a buildup layer and/or a bonding layer, and a manufacturing process of the multilayer board.
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申请公布号 |
US2004091688(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030703488 |
申请日期 |
2003.11.10 |
申请人 |
GAKU MORIO;IKEGUCHI NOBUYUKI;OMORI TAKABUMI |
发明人 |
GAKU MORIO;IKEGUCHI NOBUYUKI;OMORI TAKABUMI |
分类号 |
B32B27/08;H05K3/46;(IPC1-7):B32B3/00;B31B1/60 |
主分类号 |
B32B27/08 |
代理机构 |
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