发明名称 Heat-resistant film base-material-inserted B-staged resin composition sheet excellent in adhesion to resin, multilayer board using the sheet and manufacturing process of the multilayer board
摘要 A heat-resistant film base-material-inserted B-staged resin composition sheet obtainable by adhering a layer of a B-staged resin composition to a heat-resistant film base material, wherein the heat-resistant film base material is plasma-treated before adhering the B-staged resin composition layer, a multilayer board using the above heat-resistant film base-material-inserted B-staged resin composition sheet in a buildup layer and/or a bonding layer, and a manufacturing process of the multilayer board.
申请公布号 US2004091688(A1) 申请公布日期 2004.05.13
申请号 US20030703488 申请日期 2003.11.10
申请人 GAKU MORIO;IKEGUCHI NOBUYUKI;OMORI TAKABUMI 发明人 GAKU MORIO;IKEGUCHI NOBUYUKI;OMORI TAKABUMI
分类号 B32B27/08;H05K3/46;(IPC1-7):B32B3/00;B31B1/60 主分类号 B32B27/08
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