| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor laser package, and inhibit unnecessary radiation of high-frequency waves applied on a semiconductor laser chip. SOLUTION: A semiconductor laser chip 1 is bonded onto a package base substrate 2, and electrode terminals 15 is provided through the package base substrate 2 vertically. Moreover, a semiconductor laser package 32 storing the semiconductor laser chip 1 is constituted. The electrode terminals 15 penetrating the package base substrate are formed of a conductive material sandwiched between two or more layers of insulating materials 16 and 17, so as to form an electrode. COPYRIGHT: (C)2004,JPO
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