发明名称 BORAZINE-BASED RESIN COMPOSITION, POROUS INSULATING FILM AND ITS FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a borazine-based resin composition which exhibits sufficient mechanical strengths and forms an insulating film permitting to attain a lower dielectric constant than conventional ones, and the like. SOLUTION: Insulating layers 5, 7 (porous insulating films) provided in a memory capacitor cell 8 is formed between a gate electrode 3 fixed on a silicon wafer 1 and an opposite electrode 8C. The insulating layers 5, 7 are obtained by applying the borazine-based resin composition, which comprises, for example, an organic silicon borazine polymer, ethylbenzene and a poly(α-methylstyrene), by a spin-coating method and drying the coated film. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004137474(A) 申请公布日期 2004.05.13
申请号 JP20030317567 申请日期 2003.09.09
申请人 HITACHI CHEM CO LTD;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY 发明人 MATSUTANI HIROSHI;UCHIMARU YUKO
分类号 C08J9/04;C08G77/56;C08G77/60;C08L83/14;C08L83/16;C09D183/14;C09D183/16;H01L21/312;(IPC1-7):C08L83/14 主分类号 C08J9/04
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