ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE WITH IMPROVED BONDING CHARACTERISTICS

摘要

PURPOSE: An adhesive tape for a semiconductor device is provided to improve a bonding characteristic by forming a thermosetting adhesive layer on at least one side of an insulating film. CONSTITUTION: An adhesive tape for semiconductor device includes an insulating film and a thermosetting adhesive layer. The thermosetting adhesive layer is disposed on at least one side of the insulating film. A product of an inverse of a thickness of the thermosetting adhesive layer and a loss elastic modulus of the thermosetting adhesive layer after thermosetting at 200 degrees is larger than 0.25 MPa/micrometers. Further, a product of an inverse of the thickness of the thermosetting adhesive layer and a retaining elastic modulus of the thermosetting adhesive layer after thermosetting at 200 degrees is larger than 1 MPa/micrometers. The thermosetting adhesive layer consists of a polyamide resin.