发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE PROVIDED WITH SELF-ORIENTATION LAYER WITH SELF-ORIENTATION CHARACTERISTIC |
摘要 |
PURPOSE: A manufacturing method of a semiconductor device is provided to improve a self-orientation characteristic by irradiating plasma of an ammonia gas and by forming a self-orientation layer on an insulating layer. CONSTITUTION: An insulating layer(10) is formed over a semiconductor substrate. A plasma of a gas having a molecular structure is excited and is irradiated on the insulating layer. Hydrogen and nitrogen are bonded in the molecular structure. A self-orientation layer(11) made of a material having a self-orientation characteristic is formed on the insulating layer. A first conductive layer made of a conductive material having the self-orientation characteristic is formed on the self-orientation layer. The gas is an ammonia gas.
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申请公布号 |
KR20040038861(A) |
申请公布日期 |
2004.05.08 |
申请号 |
KR20030076535 |
申请日期 |
2003.10.30 |
申请人 |
FUJITSU LIMITED |
发明人 |
SASHIDA NAOYA;MATSUURA KATSUYOSHI;HORII YOSHIMASA;KURASAWA MASAKI;TAKAI KAZUAKI |
分类号 |
C23C16/40;H01L21/02;H01L21/314;H01L21/8242;H01L21/8246;H01L27/06;H01L27/105;H01L27/108;(IPC1-7):H01L27/105 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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