Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100°C is used to package low application temperature hot melt adhesives.
申请公布号
WO2004037671(A1)
申请公布日期
2004.05.06
申请号
WO2003US33281
申请日期
2003.10.20
申请人
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
发明人
HARWELL, MICHAEL, G.;HANER, DALE, L.;RYAN, LEISA, A.
