Plating apparatus and plating method

摘要

A substrate treating apparatus provided with a plating unit, a bevel etching unit, a cassette stage on which a cassette for accommodating a wafer and a cassette for accommodating a dummy wafer are placed, and a transport robot for transporting the wafer or the dummy wafer among the cassettes, the plating unit and the bevel etching unit. The plating unit is capable of performing a copper plating process on the wafer and the dummy wafer, and the bevel etching unit is capable of etching a peripheral edge of the wafer and etching away a copper film formed on the dummy wafer.