发明名称 SUBSTRATE CONNECTING STRUCTURE AND FABRICATING PROCESS OF ELECTRONIC PARTS THEREWITH
摘要 <P>PROBLEM TO BE SOLVED: To make it possible to contribute to heightening an added value of a liquid crystal display by enhancing its sophistication and narrowing its picture frame due to enabling application to reduction in electrode pitch with reliability ensured in both connection and insulation resistance, with regard to a substrate connecting structure of the liquid crystal display in which conductive particles ACF 10 are intervened between a display substrate 8b of a liquid crystal panel 1 and a driving IC 4, the display substrate 8b and the drive IC 4 are connected mechanically to each other by an insulative adhesive agent 12 within the ACF 10, and pads 7 on the display substrate 8b and bump electrodes 9 on the drive IC 4 are connected electrically by the conductive particles 11 within the ACF 10. <P>SOLUTION: Insulation bodies 13 with much the same heights as those of the bump electrodes 9 are arranged between the bump electrodes 9 and 9 that are juxtaposed to each other on the drive IC 4. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004134653(A) 申请公布日期 2004.04.30
申请号 JP20020299061 申请日期 2002.10.11
申请人 SHARP CORP 发明人 MATSUI TAKASHI;MATSUMOTO MASAYUKI;SHIODA MOTOJI
分类号 H01L21/60 主分类号 H01L21/60
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