| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which exhibits excellent resistant to chemicals, dielectric properties, low water absorption properties, heat resistance, flame retardance, and mechanical properties after curing, and is suitable for dielectric materials, insulation materials, heat-resistant materials, structural materials and the like. SOLUTION: The curable resin composition is composed of a polyphenylene ether resin (which may be a reactive functional group-introduced polyphenylene ether resin) as component (A) and a divinylbiphenyl compound, a divinylnaphthalene compound or a prepolymer thereof as component (B) and, based on the sum of components (A) and (B), the compounding amount of component (A) is 30-98 wt.% and that of component (B) is 2-70 wt.%. The curable resin composition may further contain a thermosetting resin (C) and a filler (D). COPYRIGHT: (C)2004,JPO
|
