发明名称 Method of making a dry bonded paperboard structure
摘要 A method of making a spirally wound dry bonded paperboard structure. The method includes adding a radio frequency active adhesive to the paperboard pulp stock during the paperboard fabrication process to first produce an RF active adhesive impregnated paperboard. The impregnated paperboard is then exposed to an RF energy field prior to or during winding, which activates the adhesive. The invention eliminates the need to apply a water-based adhesive to the paperboard prior to forming the structure, thereby reducing water migration into the paperboard.
申请公布号 US2004079501(A1) 申请公布日期 2004.04.29
申请号 US20020065487 申请日期 2002.10.23
申请人 MORIN JEREMY E.;VARADARAJAN KRISHNARAJU 发明人 MORIN JEREMY E.;VARADARAJAN KRISHNARAJU
分类号 B31C3/00;D21H17/33;D21H17/36;D21H17/48;D21H17/51;D21H17/53;D21H17/59;D21H21/18;D21H23/04;D21H25/06;D21H27/30;(IPC1-7):D21H27/30 主分类号 B31C3/00
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