System and method for utilization of waste heat of semiconductor equipment and heat exchanger used for utilization of waste heat of semiconductor equipment

摘要

An amount of energy consumption in a semiconductor fabrication facility can be reduced by using cooling water drained from a semiconductor fabrication apparatus as a heat source of another semiconductor fabrication apparatus. Cooling water of 80° C. drained from a heating furnace of a heat processing apparatus (10) is supplied to a deionized water heating apparatus (32) of a cleaning apparatus (30). The deionized water heating apparatus (32) raises a temperature of deionized water of a room temperature to 60° C. through heat exchange with the cooling water of 80° C. The cooling water, whose temperature falls to 30° C. after the heat exchange, is reutilized for cooling of the heating furnace (12).