| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent photosensitivity, water resistance, etc., and a printed wiring board using the same. <P>SOLUTION: The photosensitive resin composition contains an epoxy resin, a photoacid initiator for curing the epoxy resin, an inorganic filler, and a coupling agent, in which the coupling agent has a cyclic ether group. Also, the cyclic ether group is at least one among an epoxy group, oxetane group and 3, 4-epoxy cyclohexyl group. A silane coupling agent is preferable as the coupling agent. The print wiring board has a substrate 1 provided with an insulating layer 12 and a conductor layer 14 and a solder resist layer 2 laminated on the surface of the substrate 1. At least either of the insulating layer 12 and the solder resist layer 2 consists of the cured matter formed by curing the photosensitive resin composition. <P>COPYRIGHT: (C)2004,JPO |
