| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To meet the requirement for higher integration and higher density in a mounting technique of a semiconductor device, for example, and to enable connection or the like of a first step of step junction, for example, by using a connecting material which does not include Pb. <P>SOLUTION: A substrate 42 has a number of electrodes. An electrode of the substrate 42 is jointed to an electrode 44 provided to another substrate 46 by a junction material 40 whose main material is composite metallic nanoparticles produced by combining and coating the circumference of a metal core of an average diameter of about 100nm or less with an organic matter. <P>COPYRIGHT: (C)2004,JPO</p> |
