Stokerli kati yakit kazanlarina sürekli yakit verme,curuf kirma, kül yayma, atesin üzerini açma ve kül bosaltma sistemi,申请号TR20040000239U-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Stokerli kati yakit kazanlarina sürekli yakit verme,curuf kirma, kül yayma, atesin üzerini açma ve kül bosaltma sistemi
摘要
申请公布号	TR200400239(U)	申请公布日期	2004.04.21
申请号	TR20040000239U	申请日期	2004.02.12
申请人	OEZTUERK AHMET	发明人	OEZTUERK AHMET
分类号	G05B;(IPC1-7):G05B	主分类号	G05B
代理机构		代理人
主权项
地址

您可能感兴趣的专利

一种座椅垫固定结构及其使用方法

一种工业水循环利用的系统

一种高溶解性蜡质玉米淀粉膜的制备方法

一种无动力河道曝气系统

非还原性末端的不饱和型甘露糖醛酸寡糖及包含其作为有效成分的组合物

ELECTRONIC PACKAGE THAT INCLUDES A PLURALITY OF INTEGRATED CIRCUIT DEVICES BONDED IN A THREE-DIMENSIONAL STACK ARRANGEMENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

CROSSTALK POLARITY REVERSAL AND CANCELLATION THROUGH SUBSTRATE MATERIAL

DIRECTIONAL COUPLER

FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALLY STACKED CHIPS AND COMPONENTS

LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME

POWER MODULE AND METHOD OF MANUFACTURING POWER MODULE

METHOD FOR EVALUATING CONCENTRATION OF DEFECT IN SILICON SINGLE CRYSTAL SUBSTRATE

SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED GATE CONTACTS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF

CONVEYANCE EQUIPMENT

Debonding Temporarily Bonded Semiconductor Wafers

METHODS OF ETCHBACK PROFILE TUNING

PLASMA ETCHING METHOD, PATTERN FORMING METHOD AND CLEANING METHOD