发明名称 METHOD AND DEVICE FOR SUPER PRECISE CENTERLESS GRINDING
摘要 PROBLEM TO BE SOLVED: To efficiently perform centerless grinding finishing for a plurality of tapered surfaces having different tapered angles with super high precision of less than 0.1 microns at a low cost. SOLUTION: A preliminary finishing part P and a super high precision finishing part F constituted of two pairs of centerless grinding mechanisms having the same shape and dimension are installed in parallel on a common bed B. A workpiece (not illustrated because the workpiece is very small in a scale of this figure) is preliminarily finished with high precision (micron order) by the preliminary finishing part P. The centerless grinding finishing is performed for a tapered part with super high precision by the super high precision finishing part F. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004114179(A) 申请公布日期 2004.04.15
申请号 JP20020277785 申请日期 2002.09.24
申请人 MICRON SEIMITSU KK 发明人 SAKAE MOHEE;SHIKAMA SHIGEMI;TAKAHASHI MASAYUKI
分类号 B23Q11/10;B24B5/24;B24B53/053;B24B55/02;(IPC1-7):B24B5/24 主分类号 B23Q11/10
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