发明名称 Homogeneous fixed abrasive polishing pad
摘要 A homogeneous fixed abrasive polishing article, or pad, including a matrix of a cured resin coated soft filler material having at least one working surface and an abrasive uniformly distributed throughout the filler material. A method for manufacturing the polishing pad includes the steps of mixing a binder, solvent and filler material together; drying the resin coated filler material; grinding the resin coated filler material; sieving the resin coated filler material; mixing an abrasive material with the resin coated filler material; sieving the abrasive material and the resin coated filler material thereby creating a powder material; transferring the powder material to a mold to form a working surface for the polishing pad; compressing the powder material; and curing the powder material. Alternatively, the abrasive may be mixed with the binder, solvent and filler material in the first step instead of later in the process.
申请公布号 US2004068937(A1) 申请公布日期 2004.04.15
申请号 US20030712367 申请日期 2003.11.12
申请人 KAMBOI SUMANT 发明人 KAMBOI SUMANT
分类号 B24B37/04;B24D3/28;B24D7/12;(IPC1-7):B24D3/00;B24D5/00;B24D7/00;B24D11/00 主分类号 B24B37/04
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