发明名称 SUBSTRATE-MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a machining method for easily separating a substrate into desired shapes. <P>SOLUTION: The machining method comprises a process of arranging a mask 6 on the desired shape 2 on one face of the substrate 1; a process of separating into the substrate 1 of the desired shape 2 by jetting abrasive grains on one face of the substrate 1; a process of separating the substrate 1 from a double-sided tape 5 on a pedestal 4; and a process of jetting the abrasive grains on at least an outer peripheral part of the desired shape 2 on the other face of the substrate 1. In the substrate 1 of the desired shape 2, a solar cell device 3 is formed, the light-receiving face of the solar cell device 3 is the other face of the substrate 1, and is roughened in a process of abrasive grain jetting. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004119925(A) 申请公布日期 2004.04.15
申请号 JP20020284852 申请日期 2002.09.30
申请人 SANYO ELECTRIC CO LTD 发明人 MAEHANE MASAYOSHI;NOMURA TOSHIHIRO
分类号 H01L31/04;(IPC1-7):H01L31/04 主分类号 H01L31/04
代理机构 代理人
主权项
地址