Oscillator package

摘要

An oscillator package with an improved crystal mount. The oscillator package has substrate with a top cavity and a bottom cavity. Vias extend through the substrate between the top and bottom cavities. A semiconductor die is located in the bottom cavity and is covered by a sealant. A crystal is located in the top cavity. The crystal is mounted in the top cavity using a thermosonically deposited gold bump. The gold bump is attached between an electrode pad and a contact pad. The gold bump provides an electrical connection between the crystal and the substrate and supports the crystal. A cover and seal ring are attached to substrate to hermetically seal the top cavity.