| 摘要 |
PROBLEM TO BE SOLVED: To provide a cured resin product having a low water (moisture) absorptivity, high heat resistance, and high adhesion, and especially, one useful for wiring boards and insulation materials for electrical and electronic components. SOLUTION: The cured product is prepared by synthesizing an epoxy resin represented by formula (1), preparing an epoxy resin composition containing the epoxy resin, and curing the epoxy resin composition. In formula (1), n is an average value and is a positive number of 0-10; G is a glycidyl group; Rs are each independently a hydrogen atom, a 1-10C hydrocarbon group, or a halogen atom; a plurality of ms are each independently an integer of 0-3; and X is a hydrogen atom or a glycidyl group. COPYRIGHT: (C)2004,JPO
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