| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a polishing material from chipping in polishing while providing a sufficient polishing effects, and also to prevent polishing chips ground from the ceramic sintered body from sticking again to the ceramic sintered body in polishing the surface of a ceramic electronic component. <P>SOLUTION: The plurality of ceramic sintered bodies, the polishing materials, and buffer solution are mixed in a vessel, the polishing materials collide against the surfaces of the ceramic sintered bodies so as to polish the surface of the ceramic sintered bodies. In this process, when the bulk density of the polishing material is set to W, and the true density is set toρ, a free volume of the polishing material defined by (1-W/ρ)×100(%) is set to not less than 40% and not more than 90%. <P>COPYRIGHT: (C)2004,JPO</p> |
