Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times

摘要

A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.