COPPER PLATING METHOD FOR FORMING STEPPED PROFILE OF FINE PATTERNS ON FLAT COPPER SUBSTRATE

摘要

PURPOSE: A copper plating method for forming stepped profile of fine patterns on flat copper substrate is provided to improve reliability of patterns by forming fine patterns through photograph processing technology and perform copper plating of high aspect ratio by forming patterns using photosensitive thick film with superior transmittancy. CONSTITUTION: The copper plating method for forming stepped profile of fine patterns on a flat copper substrate(1) comprises first process of forming fine patterns produced by a photosensitive thick film(2); second process of plating copper on the fine patterns; a repetition process of repeating the steps of forming fine patterns on the electroplated copper layer(4) and plating copper on the fine patterns in the same method as in the first and second processes so that electroplated copper layers formed by performing the first and second processes are laid up sequentially; and a final process of removing the photosensitive thick film after finishing the repetition process.