发明名称 ION PLATING SYSTEM AND ION PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a deposition system and deposition method capable of depositing films densified to a high degree. SOLUTION: An evaporation source 2 packed with a thin film forming material is disposed within a vacuum chamber 1 consisting of a conductive material and a cylindrical substrate holder 5 consisting of the conductive material is disposed therein. A disk-shaped substrate 7 is attached to a substrate holding section 5a of the substrate holder 5 and further, annular permanent magnets 8A and 8B aligned in the central axes to the substrate 7 are arranged on the surface of the substrate 7 on the side opposite to its deposition surface. The permanent magnets 8A and 8B are fixed by a magnet fixing plate 17 composed of a magnetic material. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004099983(A) 申请公布日期 2004.04.02
申请号 JP20020263966 申请日期 2002.09.10
申请人 SHIN MEIWA IND CO LTD 发明人 TOKOMOTO ISAO
分类号 G02B5/28;C23C14/32;G02B1/10;(IPC1-7):C23C14/32 主分类号 G02B5/28
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