发明名称 Electron beam exposure apparatus, electron beam exposure apparatus calibration method, and semiconductor element manufacturing method
摘要 An electron beam exposure apparatus for controlling deflection timing of an electron beam with high precision, including: a blanking-electrode array having a deflecting electrode for deflecting an electron beam; a deflection timing control section for outputting the control signal for controlling the blanking-electrode array; a load circuit, of which the impedance is the same as that of the blanking-electrode array, where the wire length between the deflection timing control section and the load circuit is shorter than the wire length between the deflection timing control section and the deflecting electrode of the blanking-electrode array; and a switching section, connecting with the deflection timing control section, the blanking-electrode array, and the load circuit, for switching the destination of the control signal output from the deflection timing control section between the blanking-electrode array and the load circuit.
申请公布号 US2004061065(A1) 申请公布日期 2004.04.01
申请号 US20030672435 申请日期 2003.09.26
申请人 ADVANTEST CORPORATION;HITACHI, LTD.;CANON KABUSHIKI KAISHA 发明人 HASHIMOTO SHIN-ICHI;YODA HARUO;MURAKI MASATO
分类号 G03F7/20;G21K1/087;H01J37/147;H01J37/305;H01J37/317;H01L21/027;(IPC1-7):G21K1/08;H01J3/14 主分类号 G03F7/20
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