发明名称 Power semiconductor device with high radiating efficiency
摘要 A discrete semiconductor device (1) is vertically sandwiched between an upper wall of a case body (5) and a case bottom plate (7) to be fixed inside a case. The discrete semiconductor device (1) is fitted in the case to be positioned on a predetermined portion inside the case with high accuracy. A space defined by a side surface of the discrete semiconductor device (1) and an inner wall of the case forms a duct (9) for a coolant used for cooling the discrete semiconductor device (1). The discrete semiconductor device (1), except main electrodes (2A and 2B) and signal terminals (3), is immersed in the coolant. With this structure provided is a power semiconductor device which allows an increase in radiating efficiency of a power semiconductor element and reduction in manufacturing cost.
申请公布号 US2004061138(A1) 申请公布日期 2004.04.01
申请号 US20030378840 申请日期 2003.03.05
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SHINOHARA TOSHIAKI;YOSHIDA TAKANOBU
分类号 H01L23/44;H01L23/473;H01L25/11;(IPC1-7):H01L23/34 主分类号 H01L23/44
代理机构 代理人
主权项
地址