发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device is manufactured by a method in which the number of heat treatments at a high temperature (600° C. or higher) is reduced to thereby achieve a process at a low temperature (600° C. or lower), and a simplified process and improvement in throughput are realized. An impurity region to which a rare gas element (also called a rare gas) is added is formed on a semiconductor film of a crystalline structure by using a mask. Gettering is performed in such a manner that a metallic element contained in the semiconductor film is caused to segregate in the impurity region by heat treatment. The impurity region is thereafter used as a source or drain region.
申请公布号 US6713323(B2) 申请公布日期 2004.03.30
申请号 US20020058158 申请日期 2002.01.29
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;NAKAMURA OSAMU;HAMADA TAKASHI;MURAKAMI SATOSHI
分类号 H01L21/20;H01L21/00;H01L21/336;H01L21/339;H01L21/77;H01L21/84;H01L27/12;H01L29/423;H01L29/49;H01L29/786;(IPC1-7):H01L21/339 主分类号 H01L21/20
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