发明名称 METHOD FOR BONDING METAL
摘要 PURPOSE: To provide a method for bonding a plurality of dissimilar metals without producing any brittle intermetallic compound on a bonding interface. CONSTITUTION: In a method for bonding dissimilar materials, energy is given to one material 2 by using a probe 1 rotating at high speed, the material 2 is softened by the friction heat and plastically fluidized, and the material 2 is filled into a recess 4 formed in the other material 3 in advance by pushing or moving the probe, and thus the dissimilar materials are bonded to each other. Since only the material 2 is plastically fluidized, but the material 3 is not plastically fluidized, the materials 2 and 3 are not mixed with each other, and production of any intermetallic compound on the bonded interface can be suppressed.
申请公布号 KR20040025811(A) 申请公布日期 2004.03.26
申请号 KR20030016968 申请日期 2003.03.19
申请人 KABUSHIKI KAISHA HITACHI SEISAKUSHO(D/B/A HITACHI, LTD.) 发明人 OKAMOTO KAZUTAKA;HIRANO SATOSHI;INAGAKI MASAHISA;AONO YASUHISA
分类号 B23K20/12;B23K20/227;B23K103/20;(IPC1-7):B23K20/12 主分类号 B23K20/12
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