| 摘要 |
A high speed semiconductor test system is so designed that pin cards in a test head are arranged in radial directions where the DUT is placed over the center of the test head. Since each of the pin cards is arranged radially, the side which faces the center is close to the DUT, thereby minimizing the round-trip-delay (RTD). Moreover, each pin card is distanced equally from the DUT. Thus, the variation in the length of path connecting between the pin card and the DUT is minimized, and accordingly, the variation in RTD is also minimized.
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