发明名称 |
Plating method, interconnection forming method, and apparatus for carrying out those methods |
摘要 |
The present invention relates to a plating method for use in forming a liner for plating in a conductor-embedding fine recess that is defined in a surface of a semiconductor substrate, and an interconnection forming method for use in forming an interconnection using such a liner, and characterized by reducing an organic metal compound in a nonaqueous solvent to plate a surface of a base material with metal. The plating method can easily be used similarly to an aqueous electroless plating process and is capable of forming a defect-free sound metal plated layer on the surface of a substrate which has a fine recess or the like for embedding a conductor therein, and the interconnection forming method is capable of forming an embedded interconnection that comprises a defect-free sound electric conductor in a fine recess.
|
申请公布号 |
US6709555(B1) |
申请公布日期 |
2004.03.23 |
申请号 |
US20010868524 |
申请日期 |
2001.06.19 |
申请人 |
EBARA CORPORATION |
发明人 |
OGURE NAOAKI;FUKUNAGA AKIRA;NAGASAWA HIROSHI |
分类号 |
C23C18/06;C23C18/08;C23C18/16;H01L21/00;H01L21/288;H01L21/768;H01L23/532;(IPC1-7):C25D17/00;C25B15/00;C25B9/00;B05C19/02 |
主分类号 |
C23C18/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|