发明名称 HEAT-RESISTANT TEMPORARY ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain a heat-resistant temporary adhesive capable of being easily handled, before adhered to an adherend, having such excellent heat resistance that an adhesive layer formed thereof has adhesiveness at a high temperature of about 150-200°C, as well as at room temperature, after adhered to the adherend, and together having such temporary adhesiveness that the adhesive layer is easily released from the adherend, to provide a laminate composed of the adhesive and the adherend, and to provide a method for recoverying the adherend from the laminate. SOLUTION: This heat-resistant temporary adhesive contains a photocurable resin component and a photopolymerization initiator component as active ingredients. The laminate is composed of a layer obtained by curing the heat-resistant temporary adhesive and the adherend. The method for recovering the adherend from the laminate comprises heating the laminate at a temperature of≥220°C. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004083878(A) 申请公布日期 2004.03.18
申请号 JP20030182382 申请日期 2003.06.26
申请人 SUMITOMO CHEM CO LTD 发明人 FUJITA MASATO
分类号 B09B5/00;C09J4/06;C09J11/02;C09J201/00;(IPC1-7):C09J201/00 主分类号 B09B5/00
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