| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board and a plating system for use in production thereof in which freshliquid is supplied into via holes at all times when via holes are made by electrochemical plating process by optimizing the flow of electrolyte thereby eliminating stagnation point of electrolyte flow even in case of a via hole having a microdiameter. SOLUTION: In the multilayer wiring board where insulating layers of resin insulating film and conductor layers of conductor film are laid alternately in layers, a via hole connecting the upper and lower wiring layers sandwiching the insulating layer is made by at least one of electroless plating or electrolytic plating employing a laminar flow of fluid Reynolds Number (Re') 10<SP>-3</SP>-10<SP>-2.4</SP>in the vicinity of the via hole. COPYRIGHT: (C)2004,JPO |
