| 摘要 |
PROBLEM TO BE SOLVED: To provide configuration of a conductor layer and a printed wiring board that enable a conventional ferric chloride to be used as an etching solution and can increase an etching factor. SOLUTION: The printed wiring board 100 has a wiring layer 40a formed by patterning a conductor layer 40 comprising a metal layer 21 and a metal layer 31 containing nitrogen by forming an insulating layer 15 and the metal layer 21 of copper foil on both the surfaces of a core substrate 10 having a wire layer 12 a and a wire layer 12b formed on both the surfaces of an insulating base material 11 and then forming the specified-thickness metal layer 31 of copper containing 0.01 to 10 ppm nitrogen on the metal layer 21 by electrolytic copper plating while adding a dye-based compound, such as Janus Green B, as a surface active agent containing nitrogen, an imine compound, such as a polyethylene benzyl imine, etc., to a cupric sulfate bath. COPYRIGHT: (C)2004,JPO
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