| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the luminous efficiency of an LED chip and the light output efficiency from an LED-mounted board. <P>SOLUTION: In the opening state of a die D, namely when both die sections 1, 2 are separated most, a metal plate 4s is interposed (inserted and positioned) between both die sections 1, 2. Then, by driving at least one of the die sections 1, 2 by an unillustrated press drive means, a die D is closed, namely in a state where both die sections 1, 2 approach each other most. In this state, the metal plate 4s being pressed by a press projection 2a is inflated so that a void that is formed by a reflection surface correspondence section 1b existing at the side of a first die section 1 from the plate thickness section and a reflection surface thickness formation section 1c is buried, and performs forming machining. Then, by the shape of a portion 2b facing a conical placement surface correspondence section 1a, the metal plate 4s in contact with the placement surface correspondence section 1a cannot maintain the surface state, thus forming a new surface. <P>COPYRIGHT: (C)2004,JPO |
