发明名称 THIN FILM FORMING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a thin film forming system capable of supplying gaseous raw materials uniformly onto a substrate surface, thereby uniformizing the thickness of an organic thin film formed on the substrate surface. SOLUTION: The thin film forming system is provided with a vacuum chamber 11, a substrate holder 12 disposed within the vacuum chamber 11 and a gas supply end 22 for supplying the gas toward a substrate fitting surface 12a of the substrate holder 12. The gas supply end 22 is so formed that the gaseous raw materials are supplied in a longer form to the surface 12a. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004076150(A) 申请公布日期 2004.03.11
申请号 JP20020293280 申请日期 2002.10.07
申请人 SONY CORP 发明人 SASAKI KOJI;NARUI HIRONOBU;YANASHIMA KATSUNORI;MEMESAWA SATOHIKO
分类号 H05B33/10;C23C14/12;C23C14/24;C23C16/455;H01L51/50;(IPC1-7):C23C16/455;H05B33/14 主分类号 H05B33/10
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