发明名称 |
Submount integrated photodiode and laser diode package using the same |
摘要 |
Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area.
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申请公布号 |
US6703677(B2) |
申请公布日期 |
2004.03.09 |
申请号 |
US20020231029 |
申请日期 |
2002.08.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE KYUNG HO;YOON JEONG HO;OH BANG WON;YANG SI YOUNG;LEE JONG HWA |
分类号 |
H01L31/10;H01S5/02;H01S5/022;(IPC1-7):H01L27/14;H01L31/00 |
主分类号 |
H01L31/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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