PLATING METHOD OF SUBSTRATE AND PLATING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent the occurrence of a defect in a plating film caused by the adsorption of bubbles on the surface to be plated. SOLUTION: The bubbles 105 which are adsorbed on the surface of a copper seed film 104 being the surface to be plated of a substrate 101 are removed by rotating the substrate 101 at a high speed in a plating solution 106. Thereafter, a copper plating film 107 is grown on the copper seed film 104 by rotating the substrate 101 at a low speed in the plating solution 106. COPYRIGHT: (C)2004,JPO