BIT FAIL MAP COMPRESSION WITH FAIL SIGNATURE ANALYSIS

摘要

A method for providing a compressed bit fail map, in accordance with the invention includes the steps of testing a semiconductor device to determine failed devices and transferring failure information to display a compressed bit map by designating areas of the bit map for corresponding failure locations on the semiconductor device. Failure classification is provided by designating shapes and dimensions of fail areas in the designated areas of the bit map such that the fail area shapes and dimensions indicate a fail type.