| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image sensing device which is reduced in size, increased in drive speed, and improved in reliability by mounting a solid-state image sensing element substrate on a support member. SOLUTION: The solid-state image sensing device is equipped with a semiconductor substrate 101 where a solid-state image sensing element is formed, and a transparent member 201 which is connected to the semiconductor substrate 101 facing the light receiving region of the solid-state image sensing element through the intermediary of a space, and the semiconductor substrate 101 is mounted on the support member 701. COPYRIGHT: (C)2004,JPO
|
