| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which achieves cost reduction, miniaturization, heat radiation improvement and the like. SOLUTION: The casing-integrated semiconductor module is a semiconductor module (1), composed of a metal base wiring board (10) which is composed of an insulating layer (12) formed on a metal base (15) and a wiring layer (13) formed thereon, and a semiconductor device (20) packaged on the wiring layer; the metal base comprises at least a part of a casing of equipment, to which the semiconductor module is mounted. A part of the casing is formed as the metal base of the wiring board, such that the semiconductor module achieves cost reduction, miniaturization, heat radiation improvement and the like as a whole. COPYRIGHT: (C)2004,JPO |
