| 摘要 |
A damping and muffling structure for EL device includes a transparent front electrode layer, a lighting layer, an inducing layer, a back electrode layer and a packaging layer which are sequentially overlaid on the front electrode layer. A damper made of de-static material is disposed on one face of the EL device distal from the front electrode layer. An insulating layer is disposed between the damper and the back electrode layer. The damper has an area sufficient for covering the bus bar of the front electrode layer. The damper is connected to a grounding pole of a driving circuit for quickly removing the charge so as to achieve damping effect and minify or even eliminate the vibration and noise caused by AC electric field.
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