| 摘要 |
A cooling system and a semiconductor apparatus, in which the cooling system may supply a reaction chamber with a coolant (such as helium or a mixture containing helium) during a semiconductor wafer fabrication process. The cooling system may generally include a printed circuit board, a coolant flow controller having a setpoint control to set a flow of coolant by transmitting a voltage signal to the printed circuit board, and a filter for removing undesired noise from the voltage signal to stabilize the flow of coolant.
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