| 摘要 |
A trench capacitor with an expanded area for use in a memory cell and a method for making the same are provided. The trench capacitor includes a vertical trench formed in a semiconductor, a doping region formed around a low portion of the trench, a collar isolation layer formed on an inner sidewall of an upper portion of the trench, a doped silicon liner layer formed on a surface of the collar isolation layer, wherein the doped silicon liner layer is electrically connected to the doping region, a dielectric layer formed on a surface of the doped silicon liner layer and inner sidewall of the lower portion of the trench, and a doped silicon material formed inside the trench. The method includes steps of (a) forming a vertical trench in a semiconductor substrate, (b) filling a sacrificing material into a lower portion of the trench, (c) forming a collar isolation layer on an inner sidewall of an upper portion of the trench, (d) removing top of the sacrificing material to expose a belt of inner sidewall of the lower portion, (e) forming a doped silicon liner layer to cover the collar isolation layer and the belt of inner sidewall of the lower portion, (f) removing the sacrificing material, (g) forming a doping region around the lower portion of the trench, (h) forming a dielectric layer on all inner surface of the trench, and (i) filling a doped silicon material into the trench.
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