Fabrication of a module of integrated circuits with a substrate and a number of components using a support for the components and forming the substrate above them with the incorporation of a metal layer

摘要

The fabrication of a module of integrated circuits, incorporating a substrate (S) and a number of components (1,2,3,4), consists of: (a) placing the components on a support (5), the components being maintained in position by an adhesive (6); (b) forming the substrate above the assembly of support and components; (c) detaching the support from the assembly of substrate and components. The formation of the substrate includes the deposition of a metal layer (7) above the components and the support, such that it covers the back surfaces (r) of the components and adopts the contours of the components on the support.