发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit including a package power dissipation protective circuit wherein examination period of user's service condition and a peripheral circuit can be reduced and breakdown due to unprepared using can be prevented simultaneously, in a semiconductor integrated circuit in which package power dissipation must be considered. SOLUTION: A current restriction circuit 2 is arranged between an output terminal 7 for outputting a constant current of an IC package 1 and a corresponding input terminal 6. In a current detecting circuit 3, value of the constant current flowing between the input and the output terminals is detected. In an internal voltage dropping detecting circuit 4, difference of voltages between the input and the output terminals is detected. By a control circuit 5, the current restriction circuit 2 is controlled in such a manner that difference of voltages between the input and the output terminals does not exceed a value wherein allowable consumption power is divided by a detected current value. As a result, control is performed automatically in such a manner that consumption power at the time of real use does not exceed the maximum allowable consumption power of a package, in a semiconductor integrated circuit outputting a constant current. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004047798(A) 申请公布日期 2004.02.12
申请号 JP20020204157 申请日期 2002.07.12
申请人 RENESAS TECHNOLOGY CORP 发明人 TSUCHIYAMA TOMONORI
分类号 H01L21/822;H01L27/04;(IPC1-7):H01L21/822 主分类号 H01L21/822
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