发明名称 |
Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent |
摘要 |
A soldering agent for use in diffusion soldering processes contains, in a soldering paste, a mixture of at least partially metallic grains of a high-melting metal and a solder metal. In a diffusion soldering process, the solder metal reacts completely with the high-melting metal and metals belonging to parts that are to be joined to one another by the soldering process, to form an intermetallic phase.
|
申请公布号 |
US2004025976(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030384311 |
申请日期 |
2003.03.07 |
申请人 |
HUBNER HOLGER;KRIPESH VAIDYANATHAN |
发明人 |
HUBNER HOLGER;KRIPESH VAIDYANATHAN |
分类号 |
B23K35/02;B23K35/14;B23K35/26;B23K35/30;B23K35/34;(IPC1-7):C22C13/00 |
主分类号 |
B23K35/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|