发明名称 Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent
摘要 A soldering agent for use in diffusion soldering processes contains, in a soldering paste, a mixture of at least partially metallic grains of a high-melting metal and a solder metal. In a diffusion soldering process, the solder metal reacts completely with the high-melting metal and metals belonging to parts that are to be joined to one another by the soldering process, to form an intermetallic phase.
申请公布号 US2004025976(A1) 申请公布日期 2004.02.12
申请号 US20030384311 申请日期 2003.03.07
申请人 HUBNER HOLGER;KRIPESH VAIDYANATHAN 发明人 HUBNER HOLGER;KRIPESH VAIDYANATHAN
分类号 B23K35/02;B23K35/14;B23K35/26;B23K35/30;B23K35/34;(IPC1-7):C22C13/00 主分类号 B23K35/02
代理机构 代理人
主权项
地址