LASER PROCESSING METHOD AND DEVICE

摘要

PURPOSE: To solve the problem that a recessed cut is formed in a part of a substrate where a defect is removed to cause reduction in processing quality in a laser processing method of removing the residual defect of a photomask. CONSTITUTION: In the laser processing method of removing the residual defect of the photomask, the substrate is set so as to make its surface to be processed face downward, and the surface of the substrate is irradiated with a laser beam from below in an atmosphere containing halogenated hydrocarbon gas(e.g. ethyl iodide gas) to remove the residual defect.