发明名称 METHOD OF MAKING MICROELECTRONIC SPRING CONTACT ARRAY
摘要 A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.
申请公布号 AU2003249300(A1) 申请公布日期 2004.02.09
申请号 AU20030249300 申请日期 2003.07.15
申请人 FORMFACTOR, INC. 发明人 BENJAMIN, N. ELDRIDGE;GAETAN, L. MATHIEU;CARL, V. REYNOLDS
分类号 G01R31/26;G01R1/067;G01R1/073;G01R3/00;(IPC1-7):G01R3/00 主分类号 G01R31/26
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