发明名称 |
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device |
摘要 |
A method for manufacturing a semiconductor device includes the steps of: (1) forming a plurality of electrically conductive parts on portions of an adhesive layer of an adhesive sheet, the adhesive sheet having a base layer and the adhesive layer; (2) attaching at least one semiconductor element having electrodes to the adhesive layer, wherein an electrode-free side of the semiconductor element is attached to the adhesive layer; (3) electrically connecting a wire between each of the electrically conductive parts and each of the electrodes of the semiconductor element; (4) sealing the semiconductor element in a sealing resin to form a semiconductor device on the adhesive sheet; and (5) separating the adhesive sheet from the semiconductor device. This method enables the production of thin semiconductor devices with a surface mount type.
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申请公布号 |
US2004018659(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
US20030611290 |
申请日期 |
2003.07.01 |
申请人 |
HOSOKAWA KAZUHITO;OKEYUI TAKUJI;FUJII HIROFUMI;YAMAMOTO YASUHIK |
发明人 |
HOSOKAWA KAZUHITO;OKEYUI TAKUJI;FUJII HIROFUMI;YAMAMOTO YASUHIK |
分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L21/68;H01L23/31;(IPC1-7):H01L21/44;H01L21/50;H01L23/02;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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