| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To set copper as an object of wire bonding in a method for forming an initial bowl of a wire for wire bonding and an apparatus for wire bonding. <P>SOLUTION: The apparatus 10 for wire bonding includes a capillary 16 for inserting the wire 12, a torch electrode 18 made of a low melting point material containing, for example, tin, and a DC high voltage power supply 22. When a switch of the power supply 22 is turned on, an atmospheric discharge occurs between a tip of the wire 12 and the torch electrode 18, the tip of the wire 12 is melted by the discharge to be formed in a ball-like state, the tin of the electrode 18 is heated to a high temperature and scattered to the air, tin ion 24 of the ionized plasma is attracted to the melted tip of the wire of a negative potential to the torch electrode, and the tin is adhered to the ball-like surface. Thus, the initial bowl 28 is formed in which a coating material of the low melting point is adhered to the surface. <P>COPYRIGHT: (C)2004,JPO</p> |
